Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854784 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu, Shih-Chin Lin | 2023-12-26 |
| 11824020 | Semiconductor package structure including antenna | Yen-Yao Chi, Tzu-Hung Lin | 2023-11-21 |
| 11791266 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu | 2023-10-17 |
| 11742564 | Fan-out package structure with integrated antenna | Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu | 2023-08-29 |
| 11728292 | Semiconductor package assembly having a conductive electromagnetic shield layer | Tzu-Hung Lin, I-Hsuan Peng, Wei-Che Huang, Che-Ya Chou | 2023-08-15 |
| 11688655 | Semiconductor package including lid structure with opening and recess | Chia-Cheng Chang, Tzu-Hung Lin, I-Hsuan Peng | 2023-06-27 |
| 11652273 | Innovative air gap for antenna fan out package | Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu | 2023-05-16 |
| 11574881 | Semiconductor package structure with antenna | Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu | 2023-02-07 |