Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854784 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu, Shih-Chin Lin | 2023-12-26 |
| 11791266 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu | 2023-10-17 |