Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854784 | Chip scale package structure and method of forming the same | Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu, Shih-Chin Lin | 2023-12-26 |
| 11824020 | Semiconductor package structure including antenna | Nai-Wei Liu, Tzu-Hung Lin | 2023-11-21 |
| 11791266 | Chip scale package structure and method of forming the same | Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu | 2023-10-17 |
| 11742564 | Fan-out package structure with integrated antenna | Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu | 2023-08-29 |
| 11652273 | Innovative air gap for antenna fan out package | Nai-Wei Liu, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu | 2023-05-16 |
| 11574881 | Semiconductor package structure with antenna | Nai-Wei Liu, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu | 2023-02-07 |