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Semiconductor chip package and fabrication method thereof |
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Chip scale package structure and method of forming the same |
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Semiconductor package with layer structures, antenna layer and electronic component |
Tao Cheng, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more |
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Semiconductor package structure |
Yi-Lin Tsai, I-Hsuan Peng, Yi-Jou Lin |
2023-11-28 |
| 11791266 |
Chip scale package structure and method of forming the same |
Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin |
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| 11742564 |
Fan-out package structure with integrated antenna |
Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin |
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Semiconductor package structure |
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Innovative air gap for antenna fan out package |
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Semiconductor package structure with antenna |
Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin |
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