Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854784 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Wen-Sung Hsu | 2023-12-26 |
| 11675365 | Moving robot without detection dead zone | Wei-Chung Wang, Guo-Zhen Wang | 2023-06-13 |
| 11580621 | AI frame engine for mobile edge | Jen Cheng LUNG, Pei-Kuei Tsung, Chih-Wei Chen, Yao-Sheng Wang, Shih-Che Chen +4 more | 2023-02-14 |