Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652273 | Innovative air gap for antenna fan out package | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Tzu-Hung Lin, Wen-Sung Hsu | 2023-05-16 |
| 11574881 | Semiconductor package structure with antenna | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Tzu-Hung Lin, Wen-Sung Hsu | 2023-02-07 |