Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854930 | Semiconductor chip package and fabrication method thereof | Yi-Jou Lin, I-Hsuan Peng, Wen-Sung Hsu | 2023-12-26 |
| 11830851 | Semiconductor package structure | Wen-Sung Hsu, I-Hsuan Peng, Yi-Jou Lin | 2023-11-28 |
| 11670596 | Semiconductor package structure | Wen-Sung Hsu, I-Hsuan Peng, Yi-Jou Lin | 2023-06-06 |