Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728292 | Semiconductor package assembly having a conductive electromagnetic shield layer | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu, Che-Ya Chou | 2023-08-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728292 | Semiconductor package assembly having a conductive electromagnetic shield layer | Tzu-Hung Lin, I-Hsuan Peng, Nai-Wei Liu, Che-Ya Chou | 2023-08-15 |