Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728238 | Semiconductor package with heat dissipation films and manufacturing method thereof | Cing-He Chen, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu | 2023-08-15 |
TY
Ting-Yu Yeh
Overall (2023): #225,392 of 537,848Top 45%
1
Patents 2023