Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728238 | Semiconductor package with heat dissipation films and manufacturing method thereof | Ting-Yu Yeh, Kuo-Chiang Ting, Weiming Chris Chen, Chia-Hao Hsu | 2023-08-15 |
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Cing-He Chen
Overall (2023): #481,609 of 537,848Top 90%
1
Patents 2023