Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776899 | Via array design for multi-layer redistribution circuit structure | Che-Hung Kuo | 2023-10-03 |
| 11721882 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Ya Chou, Che-Hung Kuo, Wen-Chou Wu, Nan-Cheng Chen +1 more | 2023-08-08 |
| 11710688 | Semiconductor package structure | Zheng Zeng, Che-Hung Kuo | 2023-07-25 |
| 11705413 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2023-07-18 |