Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1003037 | Wallet | — | 2023-10-31 |
| 11715754 | Semiconductor package with TSV inductor | Ching-Chung Ko, Kuei-Ti Chan | 2023-08-01 |
| 11710688 | Semiconductor package structure | Hsing-Chih Liu, Che-Hung Kuo | 2023-07-25 |
| D977831 | Wallet | — | 2023-02-14 |