Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776899 | Via array design for multi-layer redistribution circuit structure | Hsing-Chih Liu | 2023-10-03 |
| 11721882 | Semiconductor package having discrete antenna device | Fu-Yi Han, Che-Ya Chou, Wen-Chou Wu, Nan-Cheng Chen, Min-Chen Lin +1 more | 2023-08-08 |
| 11710688 | Semiconductor package structure | Hsing-Chih Liu, Zheng Zeng | 2023-07-25 |