Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705413 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Chi-Yuan Chen +1 more | 2023-07-18 |
| 11621211 | Semiconductor package structure | Ya-Jui Hsieh, Chia-Hao Hsu, Tai-Yu Chen | 2023-04-04 |