Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854877 | Semiconductor device and manufacturing method of the same | Jing-Cheng Lin, Pu Wang, Chen-Hua Yu | 2023-12-26 |
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-12-12 |
| 11824040 | Package component, electronic device and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2023-11-21 |
| 11810831 | Integrated circuit package and method of forming same | Chen-Hua Yu, Chih-Wei Wu, Szu-Wei Lu | 2023-11-07 |
| 11749607 | Package and method of manufacturing the same | Chih-Wei Wu, Chen-Hua Yu, Kuo-Chung Yee, Szu-Wei Lu | 2023-09-05 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang +5 more | 2023-08-15 |
| 11694975 | Chip package structure | Jiun-Ting Chen, Szu-Wei Lu, Chih-Wei Wu | 2023-07-04 |
| 11682645 | Plurality of stacked pillar portions on a semiconductor structure | Jung-Hua Chang, Szu-Wei Lu | 2023-06-20 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-04-04 |
| 11600595 | Semiconductor package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2023-03-07 |
| 11557568 | Package and manufacturing method thereof | Chih-Wei Wu, Szu-Wei Lu | 2023-01-17 |