Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694975 | Chip package structure | Ying-Ching Shih, Szu-Wei Lu, Chih-Wei Wu | 2023-07-04 |
JC
Jiun-Ting Chen
Overall (2023): #398,319 of 537,848Top 75%
1
Patents 2023