Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824040 | Package component, electronic device and manufacturing method thereof | Szu-Wei Lu, Ying-Ching Shih | 2023-11-21 |
| 11817111 | Perceptually-based loss functions for audio encoding and decoding based on machine learning | Roy M. Fejgin, Grant A. Davidson, Vivek Kumar | 2023-11-14 |
| 11810831 | Integrated circuit package and method of forming same | Chen-Hua Yu, Ying-Ching Shih, Szu-Wei Lu | 2023-11-07 |
| 11749607 | Package and method of manufacturing the same | Chen-Hua Yu, Kuo-Chung Yee, Szu-Wei Lu, Ying-Ching Shih | 2023-09-05 |
| 11694975 | Chip package structure | Jiun-Ting Chen, Ying-Ching Shih, Szu-Wei Lu | 2023-07-04 |
| 11659214 | Automated workflows from media asset differentials | Yadong Wang, Kyle Tacke, Shilpa Jois Rao, Boney Sekh, Andrew Swan +1 more | 2023-05-23 |
| 11636872 | Techniques for computing perceived audio quality based on a trained multitask learning model | Phillip A. Williams, William Francis Wolcott, IV | 2023-04-25 |
| 11600595 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Szu-Wei Lu | 2023-03-07 |
| 11557568 | Package and manufacturing method thereof | Szu-Wei Lu, Ying-Ching Shih | 2023-01-17 |