Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855039 | Chip package structure | Ling Li, Cheng-Lin Huang | 2023-12-26 |
| 11784091 | Structure and formation method of chip package with fan-out feature | Ling Li, Cheng-Lin Huang | 2023-10-10 |
| 11773319 | Quantum dot particles with passivation layer and manufacturing method thereof | Jing-Cheng Lin | 2023-10-03 |
| 11767591 | Detachable atomic layer deposition apparatus for powders | Jing-Cheng Lin, Chia-Cheng Ku | 2023-09-26 |
| 11739423 | Atomic layer deposition apparatus for coating on fine powders | Jing-Cheng Lin, Ta-Hao Kuo, Chia-Cheng Ku | 2023-08-29 |
| 11735456 | Alignment mechanism and alignment method of bonding machine | Jing-Cheng Lin, Mao-Chan Chang | 2023-08-22 |
| 11682645 | Plurality of stacked pillar portions on a semiconductor structure | Szu-Wei Lu, Ying-Ching Shih | 2023-06-20 |
| 11569159 | Structure and formation method of chip package with through vias | Ling Li, Cheng-Lin Huang | 2023-01-31 |