Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854826 | Metal oxide layered structure and methods of forming the same | Jing-Cheng Lin | 2023-12-26 |
| 11855039 | Chip package structure | Ling Li, Jung-Hua Chang | 2023-12-26 |
| 11848302 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2023-12-19 |
| 11784091 | Structure and formation method of chip package with fan-out feature | Ling Li, Jung-Hua Chang | 2023-10-10 |
| 11569159 | Structure and formation method of chip package with through vias | Ling Li, Jung-Hua Chang | 2023-01-31 |
| 11545463 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2023-01-03 |