Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848302 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Cheng-Lin Huang, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2023-12-19 |
| 11545463 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Cheng-Lin Huang, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2023-01-03 |