Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848302 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Lieh-Chuan Chen +2 more | 2023-12-19 |
| 11764118 | Structure and formation method of chip package with protective lid | Wen-Yi Lin, Kuang-Chun Lee, Chen-Shien Chen | 2023-09-19 |
| 11545463 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Cheng-Lin Huang, Lieh-Chuan Chen +2 more | 2023-01-03 |