Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764118 | Structure and formation method of chip package with protective lid | Kuang-Chun Lee, Chien-Chen Li, Chen-Shien Chen | 2023-09-19 |
| 11685985 | Method of manufacturing metal mask | Yun-Heng Chen | 2023-06-27 |