Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-12-12 |
| 11787164 | Apparatus for reducing fabric dimpling in electronic devices and associated methods | Phanindraja Ancha, Brian Huynh | 2023-10-17 |
| 11626444 | Image sensors with dummy pixel structures | Chung-Chuan Tseng, Chiao-Chi Wang, Chia-Ping Lai | 2023-04-11 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-04-04 |
| 11622476 | Circuit board assemblies for electronic devices | Cheng-Sheng Chen | 2023-04-04 |