Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842936 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-12-12 |
| 11699674 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2023-07-11 |
| 11637086 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Jing-Cheng Lin | 2023-04-25 |
| 11631654 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Jing-Cheng Lin | 2023-04-18 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-04-04 |