Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11754779 | Electronic devices with coherent fiber bundles | Chih-Yao Chang, Chun-Chih Chang, Nathan K. Gupta, Wei Lin, Xiani Li | 2023-09-12 |
| 11637086 | Sawing underfill in packaging processes | Szu-Wei Lu, Li-Chung Kuo, Jing-Cheng Lin | 2023-04-25 |
| 11631654 | Sawing underfill in packaging processes | Szu-Wei Lu, Li-Chung Kuo, Jing-Cheng Lin | 2023-04-18 |