Issued Patents 2023
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637086 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Li-Chung Kuo | 2023-04-25 |
| 11631654 | Sawing underfill in packaging processes | Szu-Wei Lu, Ying-Da Wang, Li-Chung Kuo | 2023-04-18 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee +1 more | 2023-04-04 |
| 11610911 | Semiconductor assemblies including combination memory and methods of manufacturing the same | — | 2023-03-21 |
| 11605579 | Semiconductor device having passivation layer and method of manufacturing the same | Li-Hui Cheng, Po-Hao Tsai | 2023-03-14 |
| 11596973 | Double-shaft shielding device and thin-film-deposition equipment with the same | Yu-Te Shen | 2023-03-07 |
| 11598006 | Wafer support and thin-film deposition apparatus using the same | Chun-Fu Wang | 2023-03-07 |
| 11597999 | Method and device for decreasing generation of surface oxide of aluminum nitride | Yao-Syuan Cheng | 2023-03-07 |
| 11562941 | Semiconductor packages having thermal conductive patterns surrounding the semiconductor die | Szu-Wei Lu | 2023-01-24 |