Issued Patents 2023
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631654 | Sawing underfill in packaging processes | Ying-Da Wang, Li-Chung Kuo, Jing-Cheng Lin | 2023-04-18 |
| 11626344 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Chih-Chien Pan | 2023-04-11 |
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee +1 more | 2023-04-04 |
| 11616034 | Integrated circuit structure, and method for forming thereof | Yi-Chao Mao, Chin-Chuan Chang, Kun-Tong Tsai, Hung Chih Chen | 2023-03-28 |
| 11600595 | Semiconductor package and manufacturing method thereof | Ying-Ching Shih, Chih-Wei Wu | 2023-03-07 |
| 11574872 | Package structure and method of manufacturing the same | Shih-Ting Lin | 2023-02-07 |
| 11562941 | Semiconductor packages having thermal conductive patterns surrounding the semiconductor die | Jing-Cheng Lin | 2023-01-24 |
| 11557568 | Package and manufacturing method thereof | Chih-Wei Wu, Ying-Ching Shih | 2023-01-17 |