Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804445 | Method for forming chip package structure | Heh-Chang Huang, Fu-Jen Li, Shyue-Ter Leu | 2023-10-31 |
| 11798860 | Semiconductor structure and manufacturing method thereof | Chien-Jung Wang | 2023-10-24 |
| 11725120 | Carrier tape system and methods of making and using the same | Chen-Ming Kuo, Jing Ruei Lu | 2023-08-15 |
| 11610827 | Package and printed circuit board attachment | Tsung-Hsing Lu, Li-Huan Chu | 2023-03-21 |