Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742276 | Semiconductor package and manufacturing process thereof | Hsu-Hsien Chen, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai | 2023-08-29 |
| 11610827 | Package and printed circuit board attachment | Pei-Haw Tsao, Tsung-Hsing Lu | 2023-03-21 |