Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742276 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Hsu-Hsien Chen, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai | 2023-08-29 |
| 11676958 | Semiconductor device including cumulative sealing structures and method and system for making of same | — | 2023-06-13 |