Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742276 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai | 2023-08-29 |
HC
Hsu-Hsien Chen
Overall (2023): #420,790 of 537,848Top 80%
1
Patents 2023