Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742276 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Hsu-Hsien Chen, Liang-Chen Lin, Hsin-Hsien Lee, Kuen-Hong Tsai | 2023-08-29 |
TH
Tsung-Yang Hsieh
Overall (2023): #220,159 of 537,848Top 45%
1
Patents 2023