Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682619 | Package component, semiconductor package and manufacturing method thereof | Kai-Chiang Wu | 2023-06-20 |
FL
Fang-Yu Liang
Overall (2023): #449,103 of 537,848Top 85%
1
Patents 2023