Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776838 | Semiconductor package and manufacturing method thereof | Sheng-Chieh Yang, Ching-Hua Hsieh, Chih-Wei Lin | 2023-10-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776838 | Semiconductor package and manufacturing method thereof | Sheng-Chieh Yang, Ching-Hua Hsieh, Chih-Wei Lin | 2023-10-03 |