Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830746 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Chih-Chiang Tsao, Jen-Jui Yu, Philip Yu-Shuan Chung +3 more | 2023-11-28 |
| 11664300 | Fan-out packages and methods of forming the same | Chih-Chiang Tsao, Chao-Wei Chiu, Chia-Lun Chang, Cheng-Shiuan Wong, Hsiu-Jen Lin +1 more | 2023-05-30 |
| 11610859 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Wei-Yu Chen +2 more | 2023-03-21 |
| 11585992 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Chia-Shen Cheng +1 more | 2023-02-21 |
| 11545465 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng | 2023-01-03 |