Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830746 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu, Philip Yu-Shuan Chung +3 more | 2023-11-28 |
| 11791192 | Workpiece holder, wafer chuck, wafer holding method | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2023-10-17 |
| 11721659 | Package structure with warpage-control element | Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2023-08-08 |
| 11610859 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2023-03-21 |