Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791192 | Workpiece holder, wafer chuck, wafer holding method | Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2023-10-17 |
| 11664300 | Fan-out packages and methods of forming the same | Chih-Chiang Tsao, Chao-Wei Chiu, Hsuan-Ting Kuo, Chia-Lun Chang, Hsiu-Jen Lin +1 more | 2023-05-30 |
| 11610859 | Reflow method and system | Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2023-03-21 |