Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830746 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu +3 more | 2023-11-28 |
| 11664300 | Fan-out packages and methods of forming the same | Chih-Chiang Tsao, Chao-Wei Chiu, Hsuan-Ting Kuo, Cheng-Shiuan Wong, Hsiu-Jen Lin +1 more | 2023-05-30 |
| 11585992 | Package structure | Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2023-02-21 |