Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830781 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang +3 more | 2023-11-28 |
| 11791192 | Workpiece holder, wafer chuck, wafer holding method | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen +2 more | 2023-10-17 |
| 11646293 | Semiconductor structure and method | Wei-Yu Chen, Philip Yu-Shuan Chung, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu | 2023-05-09 |
| 11610859 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo +2 more | 2023-03-21 |
| 11585992 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo +1 more | 2023-02-21 |