Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817413 | Semiconductor package structure comprising via structure and redistribution layer structure and method for forming the same | Po-Hao Tsai, Ming-Da Cheng, Wen-Hsiung Lu, Hsu-Lun Liu | 2023-11-14 |