Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817413 | Semiconductor package structure comprising via structure and redistribution layer structure and method for forming the same | Neng-Chieh CHANG, Po-Hao Tsai, Ming-Da Cheng, Wen-Hsiung Lu | 2023-11-14 |
| 11776881 | Semiconductor device and method | Wen-Hsiung Lu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2023-10-03 |
| 11594508 | Redistribution lines having nano columns and method forming same | Po-Hao Tsai, Ming-Da Cheng, Wen-Hsiung Lu, Kai-Di Wu, Su-Fei Lin | 2023-02-28 |