Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854955 | Fan-out package with controllable standoff | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Po-Yao Chuang, Shin-Puu Jeng | 2023-12-26 |
| 11855059 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Wei Chou | 2023-12-26 |
| 11824007 | Dual-sided routing in 3D SiP structure | Po-Hao Tsai, Po-Yao Chuang, Yi-Wen Wu, Shin-Puu Jeng, Techi Wong | 2023-11-21 |
| 11682599 | Chip package structure with molding layer and method for forming the same | Po-Hao Tsai, Techi Wong, Meng-Wei Chou, Po-Yao Chuang, Shin-Puu Jeng | 2023-06-20 |
| 11637054 | Semiconductor package and method of manufacturing the same | Shih-Ting Hung, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang | 2023-04-25 |