Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854955 | Fan-out package with controllable standoff | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2023-12-26 |
| 11855059 | Fan-out package with cavity substrate | Po-Hao Tsai, Techi Wong, Po-Yao Chuang, Shin-Puu Jeng, Meng-Liang Lin | 2023-12-26 |
| 11699598 | Semiconductor device | Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Sih-Hao Liao, Chen-Cheng Kuo +3 more | 2023-07-11 |
| 11682599 | Chip package structure with molding layer and method for forming the same | Po-Hao Tsai, Techi Wong, Meng-Liang Lin, Po-Yao Chuang, Shin-Puu Jeng | 2023-06-20 |