Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848265 | Semiconductor package with improved interposer structure | Yi-Wen Wu, Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shin-Puu Jeng | 2023-12-19 |
| 11804451 | Package structure and method of fabricating the same | Yi-Wen Wu, Shin-Puu Jeng, Po-Yao Chuang | 2023-10-31 |
| 11656051 | Bipod grip for firearms | Shanyao Lee | 2023-05-23 |
| 11637054 | Semiconductor package and method of manufacturing the same | Meng-Liang Lin, Shin-Puu Jeng, Yi-Wen Wu, Po-Yao Chuang | 2023-04-25 |
| 11592261 | Adjustable multi-angle grip for firearms | Shanyao Lee | 2023-02-28 |