Issued Patents 2023
Showing 51–75 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804443 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Kuo Lung Pan, Yu-Chia Lai +2 more | 2023-10-31 |
| 11804457 | Package structure and manufacturing method thereof | Kuo-Chung Yee | 2023-10-31 |
| 11804475 | Semiconductor package for thermal dissipation | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-10-31 |
| 11798925 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2023-10-24 |
| 11796735 | Integrated 3DIC with stacked photonic dies and method forming same | Hsing-Kuo Hsia | 2023-10-24 |
| 11791275 | Semiconductor device and method of manufacturing | Jiun Yi Wu | 2023-10-17 |
| 11784140 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2023-10-10 |
| 11784172 | Deep partition power delivery with deep trench capacitor | Chung-Hao Tsai, Chuei-Tang Wang, Chieh-Yen Chen | 2023-10-10 |
| 11776886 | Symmetrical substrate for semiconductor packaging | Jiun Yi Wu | 2023-10-03 |
| 11776935 | Semiconductor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai | 2023-10-03 |
| 11774675 | Semiconductor device and manufacturing method thereof | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Tsang-Jiuh Wu, Wen-Chih Chiou | 2023-10-03 |
| 11768338 | Optical interconnect structure, package structure and fabricating method thereof | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +5 more | 2023-09-26 |
| 11769718 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2023-09-26 |
| 11769731 | Architecture for computing system package | Chieh-Yen Chen, Chuei-Tang Wang, Chung-Hao Tsai | 2023-09-26 |
| 11764139 | Semiconductor device and method | Jing-Cheng Lin, Chi-Hsi Wu, Po-Hao Tsai | 2023-09-19 |
| 11764171 | Integrated circuit structure and method | Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai | 2023-09-19 |
| 11756852 | Semiconductor device | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-09-12 |
| 11756945 | Semiconductor device package and methods of manufacture | Jiun Yi Wu | 2023-09-12 |
| 11756801 | Stencil structure and method of fabricating package | Jiun Yi Wu | 2023-09-12 |
| 11754780 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Hua-Kuei Lin, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +5 more | 2023-09-12 |
| 11756731 | Programmable inductor | Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2023-09-12 |
| 11747563 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Shang-Yun Hou | 2023-09-05 |
| 11749582 | Package structure | Yu-Chia Lai, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai, Chien Ling Hwang +4 more | 2023-09-05 |
| 11749607 | Package and method of manufacturing the same | Chih-Wei Wu, Kuo-Chung Yee, Szu-Wei Lu, Ying-Ching Shih | 2023-09-05 |
| 11749626 | Integrated devices in semiconductor packages and methods of forming same | Kai-Chiang Wu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2023-09-05 |