Issued Patents 2023
Showing 101–125 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682593 | Interposer test structures and methods | Tzuan-Horng Liu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2023-06-20 |
| 11682655 | Semiconductor packages and methods of forming the same | Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai | 2023-06-20 |
| 11682651 | Bump-on-trace interconnect | Chen-Shien Chen | 2023-06-20 |
| 11682636 | Info structure and method forming same | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-06-20 |
| 11682629 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Kuo-Chung Yee | 2023-06-20 |
| 11682626 | Chamfered die of semiconductor package and method for forming the same | Wei-Kang Hsieh, Shih-Wei Chen, Tin-Hao Kuo, Hao-Yi Tsai | 2023-06-20 |
| 11676906 | Chip package and manufacturing method thereof | Chuei-Tang Wang | 2023-06-13 |
| 11670617 | Packages formed using RDL-last process | Ming-Fa Chen | 2023-06-06 |
| 11670519 | Redistribution structures for semiconductor packages and methods of forming the same | Yu-Hsiang Hu, Hung-Jui Kuo | 2023-06-06 |
| 11664322 | Multi-stacked package-on-package structures | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Wei-Cheng Wu | 2023-05-30 |
| 11665834 | Electronic assembly having circuit carrier and manufacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2023-05-30 |
| 11664350 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chung-Shi Liu | 2023-05-30 |
| 11664349 | Stacked chip package and methods of manufacture thereof | Ming-Fa Chen, Sung-Feng Yeh | 2023-05-30 |
| 11664287 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2023-05-30 |
| 11658134 | Inductor structure, semiconductor package and fabrication method thereof | Chih-Yuan Chang, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2023-05-23 |
| 11658392 | Package structure | Nan-Chin Chuang, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2023-05-23 |
| 11658164 | Electronics card including multi-chip module | Chien-Hsun Lee, Jiun Yi Wu | 2023-05-23 |
| 11658150 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Ming-Fa Chen | 2023-05-23 |
| 11658097 | Manufacturing method for semiconductor device including through die hole | Kuo-Chung Yee | 2023-05-23 |
| 11652063 | Semiconductor package and method of forming the same | Cheng-Hsien Hsieh, Li-Han Hsu, Wei-Cheng Wu, Hsien-Wei Chen, Der-Chyang Yeh +2 more | 2023-05-16 |
| 11652086 | Packages with stacked dies and methods of forming the same | Chien-Hsun Lee, Tsung-Ding Wang, Mirng-Ji Lii | 2023-05-16 |
| 11651994 | Processes for reducing leakage and improving adhesion | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2023-05-16 |
| 11646293 | Semiconductor structure and method | Chia-Shen Cheng, Wei-Yu Chen, Philip Yu-Shuan Chung, Hsiu-Jen Lin, Ching-Hua Hsieh | 2023-05-09 |
| 11646281 | Semiconductor structures | Hung-Jui Kuo, Hui-Jung Tsai, Tsao-Lun Chang | 2023-05-09 |
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Kuo Lung Pan, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +3 more | 2023-05-09 |