Issued Patents 2023
Showing 151–161 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2023-02-21 |
| 11587916 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chung-Hao Tsai, Tzu-Chun Tang | 2023-02-21 |
| 11587818 | Chuck design and method for wafer | Ming-Tan Lee, Hung-Jui Kuo | 2023-02-21 |
| 11581281 | Packaged semiconductor device and method of forming thereof | Kuo-Chung Yee, Chih-Hang Tung | 2023-02-14 |
| 11574853 | Semiconductor device | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-02-07 |
| 11569183 | Package structure and method of fabricating the same | Cheng-Yu Kuo, Ching-Hua Hsieh, Chung-Shi Liu, Yi-Yang Lei, Wei Huang | 2023-01-31 |
| 11569202 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2023-01-31 |
| 11569147 | Method of forming semiconductor package with composite thermal interface material structure | Tung-Liang Shao, Jen-Yu Wang, Chung-Jung Wu, Chih-Hang Tung | 2023-01-31 |
| 11562926 | Package structure and method of forming thereof | Chih-Lin Chen, Chung-Hao Tsai, Jeng-Shien Hsieh, Chuei-Tang Wang, Chih-Yuan Chang | 2023-01-24 |
| 11557546 | Semiconductor structure | Kuo-Chung Yee, Jui-Pin Hung | 2023-01-17 |
| 11545392 | Semiconductor component having through-silicon vias | Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2023-01-03 |