Issued Patents 2023
Showing 126–150 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646220 | Raised via for terminal connections on different planes | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh, Jing-Cheng Lin +1 more | 2023-05-09 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +7 more | 2023-05-02 |
| 11637097 | Method of manufacturing package structure | Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang | 2023-04-25 |
| 11637084 | Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package | Kuo-Chung Yee | 2023-04-25 |
| 11635566 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai +1 more | 2023-04-25 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo +5 more | 2023-04-18 |
| 11631993 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2023-04-18 |
| 11631611 | Wafer level chip scale packaging intermediate structure apparatus and method | Der-Chyang Yeh | 2023-04-18 |
| 11625940 | Fingerprint sensor device and method | Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu | 2023-04-11 |
| 11626296 | Fan-out structure and method of fabricating the same | An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Wei-Yu Chen | 2023-04-11 |
| 11621244 | Integrated circuit package and method | Chuei-Tang Wang, Chieh-Yen Chen, Wei Ling Chang | 2023-04-04 |
| 11616026 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2023-03-28 |
| 11614592 | Semiconductor devices and methods of manufacture | Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +4 more | 2023-03-28 |
| 11610866 | Semiconductor device and manufacturing method thereof | Wen-Chih Chiou | 2023-03-21 |
| 11612057 | Opening in the pad for bonding integrated passive device in InFO package | Cheng-Hsien Hsieh, Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, Li-Han Hsu +1 more | 2023-03-21 |
| 11610858 | Packages with Si-substrate-free interposer and method forming same | Ming-Fa Chen | 2023-03-21 |
| 11605622 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang, Hsing-Kuo Hsia | 2023-03-14 |
| 11605621 | Hybrid integrated circuit package and method | Jiun Yi Wu, Hsing-Kuo Hsia | 2023-03-14 |
| 11600574 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Yun Chen Hsieh, Hui-Jung Tsai | 2023-03-07 |
| 11602056 | Circuit board and semiconductor device including the same | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2023-03-07 |
| 11600431 | InFO coil on metal plate with slot | Chuei-Tang Wang, Wei-Ting Chen, Chieh-Yen Chen, Hao-Yi Tsai, Ming Hung Tseng +1 more | 2023-03-07 |
| 11594498 | Semiconductor package and method | Jiun Yi Wu, Chung-Shi Liu | 2023-02-28 |
| 11594571 | Stacked image sensor device and method of forming same | Wen-Chih Chiou | 2023-02-28 |
| 11594520 | Semiconductor package for thermal dissipation | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Cheng-Chieh Hsieh, Ming-Yen Chiu | 2023-02-28 |
| 11592618 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Shang-Yun Hou | 2023-02-28 |