Issued Patents 2023
Showing 26–50 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848304 | Semiconductor device and method of forming the same | Jiun Yi Wu, Shang-Yun Hou | 2023-12-19 |
| 11848234 | Semiconductor package and method comprising formation of redistribution structure and interconnecting die | Jiun Yi Wu | 2023-12-19 |
| 11848235 | System, device and methods of manufacture | Wei Ling Chang, Chuei-Tang Wang, Tin-Hao Kuo, Che-Wei Hsu | 2023-12-19 |
| 11848271 | Redistribution layer structures for integrated circuit package | Jie Chen, Ying-Ju Chen, Hsien-Wei Chen, Der-Chyang Yeh | 2023-12-19 |
| 11841541 | Package assembly and manufacturing method thereof | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang | 2023-12-12 |
| 11841618 | Photoresist system and method | Hung-Jui Kuo, De-Yuan Lu, Ming-Tan Lee | 2023-12-12 |
| 11842955 | Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structure | Hung-Jui Kuo, Ming-Che Ho, Tzung-Hui Lee | 2023-12-12 |
| 11842983 | Semiconductor structure | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang | 2023-12-12 |
| 11837567 | Semiconductor package and method of forming thereof | Jiun Yi Wu | 2023-12-05 |
| 11837575 | Bonding passive devices on active device dies to form 3D packages | Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2023-12-05 |
| 11837502 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2023-12-05 |
| 11837517 | Packaged semiconductor devices with wireless charging means | Hao-Yi Tsai, Tzu-Sung Huang, Ming Hung Tseng, Hung-Yi Kuo | 2023-12-05 |
| 11837550 | Method of forming semiconductor packages having through package vias | Chung-Shi Liu, Chih-Wei Lin, Ming-Da Cheng | 2023-12-05 |
| 11830861 | Semiconductor package | Yu-Kuang Liao, Cheng-Chun Tsai, Fang Chen, Wen-Chih Chiou, Ping-Jung Wu | 2023-11-28 |
| 11830864 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang, Hsing-Kuo Hsia | 2023-11-28 |
| 11830797 | Semiconductor device and method of manufacture | Jiun Yi Wu | 2023-11-28 |
| 11830841 | Semiconductor package and method for manufacturing the same | Chuei-Tang Wang, Chih-Chieh Chang, Yu-Kuang Liao, Hsing-Kuo Hsia, Chih-Yuan Chang +1 more | 2023-11-28 |
| 11830844 | Semiconductor structure | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-11-28 |
| 11824005 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2023-11-21 |
| 11817325 | Methods of manufacturing a semiconductor package | Jiun Yi Wu | 2023-11-14 |
| 11817380 | Semiconductor package and method of forming same | Jiun Yi Wu, Chung-Shi Liu | 2023-11-14 |
| 11817410 | Integrated circuit package and method | Wen-Chih Chiou, Shih-Ting Lin, Szu-Wei Lu | 2023-11-14 |
| 11817361 | Passivation structure with planar top surfaces | Yi-Hsiu Chen, Wen-Chih Chiou | 2023-11-14 |
| 11810831 | Integrated circuit package and method of forming same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu | 2023-11-07 |
| 11810899 | 3DIC formation with dies bonded to formed RDLs | Sung-Feng Yeh, Ming-Fa Chen | 2023-11-07 |