Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688693 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu | 2023-06-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688693 | Semiconductor packages and method of manufacture | Wei-Yu Chen, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu | 2023-06-27 |